page 1 of 5 aos semiconductor product reliability report aoz 301 3 pi re v 1.0 plasti c encapsulate d device alph a & omeg a semiconductor , inc 475 oakmead pkwy sunnyvale , c a 94085 u.s. tel : ( 408 ) 830 - 974 2 www.aosmd.com oct 8 , 20 1 3
page 2 of 5 thi s ao s produc t reliabilit y repor t summarize s th e qualificatio n resul t fo r aoz 301 3 pi (e pad so8 package) . revie w o f the electrica l tes t resul t s confirm tha t aoz301 3 pi pass ed ao s qualit y and reliabilit y requirements for product manufacturing rel ease (rtm) . the continuous qualification testing and reliability monitoring program ensure that all outgoing products will continue to meet aos quality and reliability standards. table of contents: i . produc t description ii . packag e and d i e information iii. qualification tes t requirements iv. qualification tes t s result v. reliability evaluation vi. revision history i. produc t description: aoz301 3 pi is h igh efficiency, simple to use, 3 a synchronous buck regulator . aoz301 3 pi are au&cu mixed bonding wire version of aoz 301 1pi product . both are derivatives of aoz105x product family and aoz103x product family with improved manufacturability ? updated lx pad location to eliminate down bonding. aoz 301 3 pi work s from a 4.5v to 18v input voltage range, and output voltage adjustab le down to 0.8v. it is offered in epad so - 8 package . absolut e maximu m rating s parameter supply voltage (v in ) 20 v lx to agnd - 0.7v to v in +0.3 v lx to agnd - 5v to 22v(20ns) en to agnd - 0.3v to v in +0.3 v fb to agnd - 0.3v to 6 v comp to ag nd - 0.3v to 6 v pgnd to agnd - 0.3v to 0.3 v junction temperature (t j ) +150c storage temperature (t s ) - 65c to +150c therma l characteristics package thermal resistance ( ja ) 5 0 c/w (typ.) ii. packag e and die inf o rmation: product id aoz 3013 pi (epad so - 8) process umc 5v/20v 2p3m 23bv lea d frame a194fh di e attach 8006ns( wbc )/ 84 - 3j (controller ic) / 84 - 1 lmisr4 bon d wire a u &cu mol d material g630ay msl level 2
page 3 of 5 iii. qualification tests requirement ? 1 lot of aoz 301 3 pi 168 - hr burn - in (htol) ? 1 lot of aoz 301 3 pi esd test ? 1 7 lots of htol results ( including previously released products with same processing ) for final release to manufacturing. ? 4 lot s of package qual test ing for so8_ep1 for final release to manufacturing. iv. qualification tests result s test item test condition sample size result comment htol per jesd 22 - a108_b temp = 125 c 1 lot of aoz301 3 pi 3 lots of aoz3011pi 1 lot of aoz3017pi 1 lot aoz1051pi 1 lot aoz1051pi 1 lot aoz1096pi 1 lot aoz1033ai 1 lot aoz1034pi 1 lot aoz1034pi 1 lot aoz1036 pi 1 lot aoz1038pi 3 lots aoz1037pi 1 lot aoz1037pi 1 lot aoz1031ai passed passed passed passed passed passed passed passed passed passed passed passed passed passed 1 aoz301 3 pi lot (ba0 14 ) passed 168 hrs . 2 aoz3011pi lots (ba001) passed 500 hrs . 1 aoz3011pi lot (ba004) passed 500 hrs . 1 aoz3017pi lot (ba00 2) passed 500hrs . 1 aoz1051pi lot (ba004) passed 500 hrs. 1 aoz1051pi lot (ba007) passed 168 hrs. 1 aoz1096pi lot (bab01) passed 168 hrs. 1 aoz1033ai lot (ba001 ) passed 168 hrs. 1 aoz1034pi lot (ba011) passed 168 hrs . 1 aoz1034pi lot (ba 01 3 ) passed 1 000 hrs. 1 aoz1036pi lot ( ba020 ) passed 168 hrs . 1 aoz1038pi lot (ba006) passed 168 hrs. 3 aoz1037pi lot s (ba003/ba006 /ba011 ) passed 500 hrs. 1 aoz1037pi lot (ba013) passed 168 hrs. 1 aoz1031ai lot s ( ba030 ) passed 168 hrs. esd (h bm, mm, cdm) per jesd 22 - a114, jesd 22 - a115-a, 1 aoz 301 3 pi lot 1 aoz301 3 pi lot 1 aoz301 3 pi lot passed passed passed 1 aoz301 3 p i lot (ba0 14 ) passed 2kv hbm 1 aoz301 3 pi lot (ba0 14 ) passed 200v mm 1 aoz301 3 pi lot (ba0 14 ) passed 100 0v cdm latch - up per jesd 78 1 aoz301 3 pi lot passed 1 aoz 3013 pi lot ( ba014 ) passed latch - up
page 4 of 5 v. reliability e valuation the presentation of fit rate for the individual product reliability is restricted by the actual burn - in sample size of the product. failure rate determination is based on jedec standard jesd 85. fit means one failure per billion hours. fit rate (per billion): 1 0 . 8 mttf = 9 2 . 5 9 million hrs. the failure rate () is calculated as follows: af t ss f cl u u u 1 2 )] 2 2 ( , [ 2 f o ??.. [equation 1] where cl = % of confidence level f = number of failure ss = sample size t = stress t ime looking up the 2 2 f table for zero failure (in htol) with 60% confidence, the value of 2 )] 2 2 ( , [ 2 f cl f is 0.92. so8_ep1 package qual data htol per jesd 22 - a108_b temp = 125 c 4 lots passed 4 aoz 3013 pi lots (ba003/ba004 /ba005/ba007 ) passed 500hr. bi . pre - conditioning per jesd 22 - a113 85 c 0 /85%rh, 3 cyc reflow@260 0 c 4 lots passed 4 aoz 3013 pi lots (ba003/ba004 /ba005/ba007 ) passed preconditioning. hast 1302c, 85%rh, 33.3psi, at vcc min power di ssipation 4 lots passed 4 aoz 3013 pi lots (ba003/ba004 /ba005/ba007 ) passed hast 100 hrs. temperature cycle - 65c to +150c air to air (2cyc/hr) 4 lots passed 4 aoz 3013 pi lots (ba003/ba004 /ba005/ba007 ) passe d tc 500. pressure pot 121c, 151 psig, rh= 100% 4 lots passed 4 aoz 3013 pi lots (ba003/ba004 /ba005/ba007 ) passed pct 96hr.
page 5 of 5 the acceleration factor (af) is calculated from the following formula: ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? = s o a t t k e af 1 1 exp ??.. [equation 2 ] where e a = activation energy k = boltzmann constant t o = operating t j t s = stress t j applying typical operating environment, t o = 55c; e a = 0.7ev and t s = 140c 164 140 273 1 55 273 1 5 617 . 8 7 . 0 exp = ? ? ? ? ? ? ? ? ? ? ? ? + ? + ? ? ? ? ? ? ? ? = e af taking the result of htol ( aoz 301 3 lot and previous similar products - see htol results in section iv), the total device stress time substituting the values in equation 1, we have ( ) 164 1000 80 1 500 80 8 168 80 8 168 80 1 1 92 . 0 + + + = = 1. 0 8 e - 8 hr -1 or 1 0 . 8 fit mt t f = (1/ = 9 2 . 5 9 million hours or 10 5 7 0 y ears the calculation show s that under typical operating environment, the device failure rate is less than 1 0 .8 fit or an mtt f of over 9 2.59 million hour . t he qualification tes t resul ts confirm tha t aoz 301 3 p i pass ed ao s qualit y and reliabilit y r equirements for product manufacturing release (rtm) . vi. revision history revision release date comments 1.0 o ct 8 , 201 3 initial release
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